| Model ID |
NPM-D3 |
Rear head
Front head
|
Lightweight 16-nozzle head |
12-nozzle head |
8-nozzle head |
2-nozzle head |
Dispensing head |
No head |
| Lightweight 16-nozzle head |
NM-EJM6D |
NM-EJM6D-MD |
NM-EJM6D |
| 12-nozzle head |
| 8-nozzle head |
| 2-nozzle head |
| Dispensing head |
NM-EJM6D-MD |
- |
NM-EJM6D-D |
| Inspection head |
NM-EJM6D-MA |
NM-EJM6D-A |
| No head |
NM-EJM6D |
NM-EJM6D-D |
- |
| PCB dimensions※1 |
Dual-lane mode |
L50mm×W50mm ～L510mm×W300mm |
PCB exchange |
Dual-lane mode |
0s※
※No 0s when cycle time is 3.6s or less |
| Single-lane mode |
L50mm×W50mm ～L510mm×W590mm |
time |
Single-lane mode |
3.6s※
※When selecting short conveyors |
| Electric source |
3-phase AC200,220,380,400,420,480V 2.7kVA |
| Pneumatic source※2 |
0.5MPa，100L/min（A.N.R.) |
| Dimensions※2 |
W832mm×D2652mm※3×H1444mm※4 |
| Mass |
1680kg(Only for main body:This differs depending on the option configuration.） |
| Placement head |
Lightweight 16-nozzle head(Per head） |
12-nozzle head
（Per head） |
8-nozzle head
（Per head） |
2-nozzle head
（Per head） |
| High production mode「ON」 |
High production mode「OFF」 |
| Max.speed |
42 000cph
(0.086s/chip) |
38 000cph
(0.095s/chip) |
34 500cph
(0.104s/chip) |
21 500cph
(0.167s/chip) |
5 500cph
(0.327s/chip)
4 250cph
(0.847s/QFP) |
| Placement accuracy（Cpk≥1） |
±40μm/chip |
±30μm/chip
(±25μm/chip※5) |
±30μm/chip |
±30μm/chip
±30μm/QFP
匚12mm～匚32mm
±50μm/QFP
匚12mm以下 |
±30μm/QFP |
Component
dimensions |
0402chip※6
～L6mm×W6mm
×T3mm |
03015※6※7
/0402chip※6
～L6mm×W6mm×
T3mm |
0402chip※6
～L12mm×W12mm×
T6.5mm |
0402chip※6
～L32mm×W32mm×
T12mm |
0603chip
～L100mm×W90mm
×T28mm |
Component
supply |
Taping |
Tape：4/8/12/16/24/32/44/56 mm |
Tape：4～56/72/88/104mm |
| Max.68(4、8mm tape、Small reel) |
| Stick |
- |
Max.16(Single stick feeder) |
| Tray |
- |
Max.20(per tray feeder) |
| Dispensing head |
Dot dispensing |
Draw dispensing |
| Dispensing speed |
0.16 s/dot(Condition：XY=10mm、Z=less than 4mm movement、No θrotation) |
4.25 s/component(Condition：30mm×30mm corner dispensing)※8 |
| Adhesive position accuracy(Cpk≥1） |
±75μm/dot |
±100μm/component |
| Applicable components |
1608 chip to SOP、PLCC、QFP、Connector、BGA、CSP |
SOP、PLCC、QFP、Connector、BGA、CSP |
| Inspection head |
2D inspection head(A) |
2D inspection head(B) |
| Resolution |
18μm |
9μm |
| View size |
44.4mm×37.2mm |
21.1mm×17.6mm |
| Inspection processing time |
Solder Inspection※9 |
0.35 s/View size |
| Component Inspection※9 |
0.5 s/View size |
| Inspection object |
Solder Inspection※9 |
Chip component：100μm×150μm or more(0603mm or more)
Package component：?150μm or more |
Chip component：80μm×120μm or more(0402 or more)
Package component：Ø120μm or more |
| Component Inspection※9 |
Square chip(0603 mm or more)、SOP、QFP（a pitch of 0.4mm or more)、CSP、BGA、Aluminum electrolysis capacitor、Volume、Trimmer、Coil、Connector※10 |
Square chip(0402 mm or more)、SOP、QFP（a pitch of 0.3mm or more)、CSP、BGA、Aluminum electrolysis capacitor、Volume、Trimmer、Coil、Connector※10 |
| Inspection items |
Solder Inspection※9 |
Oozing,blur,misalignment,abnormal shape,bridging |
| Component Inspection※9 |
Missing,shift,flipping,polarity,foreign object inspection※11 |
| Inspection position accuracy(Cpk≥1）※12 |
±20μm |
| No.of inspection |
Solder Inspection※9 |
Max.30 000 pcs./machine(No. of components：Max.10 000 pcs./machine) |
| Component Inspection※9 |
Max.10 000 pcs./machine |
※Placement tact time and accuracy values may differ slightly depending on conditions.
※Please refer to the specification booklet for details.
※1：Due to a difference in PCB transfer reference, a direct connection with NPM（NM-EJM9B)/NPM-W(NM-EJM2D)/NPM-W2(NM-EJM7D)dual lane specs cannot be established.
※2：Only for main body
※3：Dimension D including tray feeder:2 683 mm Dimension D including feeder cart:2 728 mm
※4：Excluding the monitor,signal tower and ceiling fan cover.
※5：±25μm placement support option.（Under conditions specified by PFSC）
※6：03015/0402 chip requires a specific nozzle/feeder.
※7：Support for 03015 mm chip placement is optional.（Under conditions specified by PSFC：Placement accuracy ±30μm/chip)
※8：A PCB height measurement time of 0.5s is included.
※9：One head cannot handle solder inspection and component inspection at the same time.
※10：Please refer to the specification booklet for details.
※11：Foreign object is available to chip components.(Excluding 03015 mm chip).
※12：This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration.It may be affected by sudden change of ambient temperature.
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