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| NPM-W2 |
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Higher productivity and quality with printing,placement and inspection process integration
Depending on the PCB you produce,you can select High-speed mode or High-accuracy mode.
For larger boards and larger components
PCBs up to a size of 750 x 550mm with component range up to L150 x W25 x T30mm.
Higher area productivity through dual lane placement
Depending on the PCB you produce,you can select an optimal placement mode-"Independent""Alternate" or "Hybrid".
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Simultaneous realization of high area productivity and
high-accuracy placement
Machine Configuration
·Rear & Front Feeder Layout
·Single Tray Layout
·Twin Tray Layout
·Automation units
High productivity·Employs dual mounting method
Operating rate improvement
Solder Inspection(SPI)·Component Inspection（AOI)·Inspection head
Adhesive Dispensing·Dispensing head
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| Model ID |
NPM-W2 |
Rear head
Front head
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Lightweight 16-nozzle head |
12-nozzle head |
Lightweight 8-nozzle head |
3-nozzle head V2 |
Dispensing head |
No head |
| Lightweight 16-nozzle head |
NM-EJM7D |
NM-EJM7D-MD |
NM-EJM7D |
| 12-nozzle head |
| Lightweight 8-nozzle head |
| 3-nozzle head V2 |
| Dispensing head |
NM-EJM7D-MD |
- |
NM-EJM7D-D |
| Inspection head |
NM-EJM7D-MA |
NM-EJM7D-A |
| No head |
NM-EJM7D |
NM-EJM7D-D |
- |
| PCB dimensions |
Single-lane※1 |
Bath mounting |
L50mm×W50mm ～L750mm×W550mm |
2-positin mounting |
L50mm×W50mm ～L350mm×W550mm |
| Dual-lane※1 |
Dual transfer(Batch) |
L50mm×W50mm ～L750mm×W260mm |
Dual transfer(2-positin) |
L50mm×W50mm ～L350mm×W260mm |
| Single transfer(Batch) |
L50mm×W50mm ～L750mm×W510mm |
Single transfer(2-positin) |
L50mm×W50mm ～L350mm×W510mm |
| Electric source |
3-phase AC200,220,380,400,420,480V 2.8kVA |
| Pneumatic source※2 |
0.5MPa，200L/min（A.N.R.) |
| Dimensions※2 |
W1280mm※3×D2332mm※4×H1444mm※5 |
| Mass |
2470kg(Only for main body：This differs depending on the option configuration） |
| Placement head |
Lightweight 16-nozzle head(Per head) |
12-nozzle head(Per head) |
Lightweight 8-nozzle head (Per head) |
3-nozzle head V2(Per head) |
| High production mode「ON」 |
High production mode「OFF」 |
High production mode 「ON」 |
High production mode 「OFF」 |
| Max.speed |
38 500cph
(0.094s/chip) |
35 000cph
(0.103s/chip) |
32250cph
(0.112s/chip) |
31250cph
(0.115s/chip) |
20 800cph
(0.1737s/chip) |
8 320cph
(0.433s/chip)
6 500cph
(0.554s/QFP) |
| Placement accuracy（Cpk≥1） |
±40μm/chip |
±30μm/chip
(±25μm/chip※7) |
±40μm/chip |
±30μm/chip |
±30μm/chip
±30μm/QFP
匚12mm～
匚32mm
±50μm/QFP
匚12mm Under |
±30μm/QFP |
| Component dimensions |
0402chip※7
～L6mm
×W6mm
×T3mm |
03015※7※
8/0402chip※7
～L6mm
×W6mm
×T3mm |
0402chip※7
～L12mm×W12mm
×T6.5mm |
0402chip※7
～L32mm
×W32mm
×T12mm |
0603chip
～L150mm
×W25mm
(diagonal152)×T30mm |
| Component supply |
Taping |
Tape：4/8/12/16/24/32/44/56 mm |
Tape：4～56mm |
Tape：4～56/72/88/104mm |
| Max.120(Tape：4、8mm) |
Front/rear feeder cart specifications:Max.120(Tape width and feeder are subject to the conditions on the left)
Single tray specifications:Max.86(Tape width and feeder are subject to the conditions on the left)
Twin tray specifications:Max.60(Tape width and feeder are subject to the conditions on the left) |
| Stick |
- |
Front/rear feeder cart specifications:Max.30(Single stick feeder)
Single tray specifications:Max.21(Single stick feeder)
Twin tray specifications:Max.15(Single stick feeder) |
| Tray |
- |
Single tray specifications:Max.20
Twin tray specifications:Max.40 |
| Dispensing head |
Dot dispensing |
Draw dispensing |
| Dispensing speed |
0.16 s/dot(Condition：XY=10mm、Z=less than 4mm movement,Noθrotation) |
4.25 s/component(condition：30mm×30mm corner dispensing)※9 |
| Adhesive position accuracy(Cpk≥1） |
±75μm/dot |
±100μm/component |
| Applicable components |
1608 chip to SOP、PLCC、QFP、Connector、BGA、CSP |
BGA、CSP |
| Inspection head |
2D inspection head(A) |
2D inspection head(B) |
| Resolution |
18μm |
9μm |
| View size |
44.4mm×37.2mm |
21.1mm×17.6mm |
| Inspection processing time |
Solder Inspection※10 |
0.35 s/View size |
| Component Inspection※10 |
0.5 s/View size |
| Inspection object |
Solder Inspection※10 |
Chip component：100μm×150μm or more(0603 or more)
Package component：?150μm or more |
Chip component：80μm×120μm or more(0402 or more)
Package component：?120μm or more |
| Component Inspection※10 |
Square chip(0603 or more)、SOP、QFP（a pitch of 0.4mm or more)、CSP、BGA、Aluminum electrolysis capacitor、Volume、Trimmer、Coil、Connector※11 |
Square chip(0402 or more)、SOP、QFP（a pitch of 0.3mm or more)、CSP、BGA、Aluminum electrolysis capacitor、Volume、Trimmer、Coil、Connector※11 |
| Inspection items |
Solder Inspection※10 |
Oozing,blur,misalignment,abnormal shape,bridging |
| Component Inspection※10 |
Missing,shift,flipping,polarity,foreign object inspection※12 |
| Inspection position accuracy(Cpk≥1）※13 |
±20μm |
±10μm |
| No.of inspection |
Solder Inspection※10 |
Max.30 000 pcs./machine(No.of components：Max.10 000 pcs./machine) |
| Component Inspection※10 |
Max.10 000 pcs./machine |
※Placement tact time and accuracy values may differ slightly depending on conditions.
※Please refer to the specification booklet for details.
※1：Please consult us separately should you connect it to NPM-D3/D2/D.It cannot be connected to NPM-TT and NPM
※2：Only for main body
※3：1 880--in width if extension conveyors(300 mm) are placed on both sides
※4：Dimension D including tray feeder :2 570 mm Dimension D including feeder cart :2 465 mm
※5：Excluding the monitor,signal tower and ceiling fan cover.
※6：±25μm placement support option.(Under conditions specified by PFSC)
※7：The 03015/0402 chip requires a specific nozzle/feeder.
※8：Support for 03015 mm chip placement is optional（Under conditions specified by PSFC：Placement accuracy ±30μm/chip)
※9：A PCB height measurement time of 0.5s is included.
※10：One head cannot handle solder inspection and component inspection at the same time.
※11：Please refer to the specification booklet for details.
※12：Foreign object is available to chip components.（Excluding 03015 mm chip）
※13：This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration.
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